DB Discharge Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported
Magazine Discharge Module : The completed die bonder or substrate is sent to the magazine discharge module via the transfer mechanism to be collected and stacked neatly in the magazine, and the empty magazine can be replaced automatically when the magazine is full. This module is a common standard module in Die Bonder or semiconductor equipment. The stp version is included, welcome to download!
Specification: DB Discharge Module For Semiconductor Packaging Equipment (CreoProE), 3D Exported
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